Electrodissolution Processes: Fundamentals and Applications discusses the basic principles involved in high-rate anodic dissolution processes and their application in advanced machining, micromachining, and finishing operations. The fundamentals section of the book discusses the anodic dissolution behavior of different classes of metals and the influence of mass transport, current distribution, and surface film properties on the metal removal rate and surface finishing. The applications section of the book presents essential elements of electrochemical and assisted techniques for precision machining, micromachining, and polishing of advanced materials, including hard-to-machine conducting ceramic materials. Features A first-of-its-kind book that provides updated scientific and engineering information related to high-rate anodic dissolution processes Highlights the importance of the understanding of basic principles required for designing and optimizing ECM/EMM/EP processes Gives equal emphasis to the fundamentals and applications of electrodissolution processes Discusses the high-rate anodic dissolution of two broad classes of materials, namely, engineering and refractory materials Presents case studies to demonstrate the capabilities of different electrochemical and assisted machining, micromachining, and finishing operations Presents a dedicated chapter on electrochemical planarization of copper interconnects Madhav Datta is the Chairman of Amrita Center for Industrial Research and Innovation and a Distinguished Professor in the Department of Chemical Engineering and Materials Science, Amrita University, Coimbatore, India.

Electrodissolution Processes: Fundamentals and Applications discusses the basic principles involved in high-rate anodic dissolution processes and their application in advanced machining, micromachining, and finishing operations. The fundamentals section of the book discusses the anodic dissolution behavior of different classes of metals and the influence of mass transport, current distribution, and surface film properties on the metal removal rate and surface finishing. The applications section of the book presents essential elements of electrochemical and assisted techniques for precision machining, micromachining, and polishing of advanced materials, including hard-to-machine conducting ceramic materials. Features A first-of-its-kind book that provides updated scientific and engineering information related to high-rate anodic dissolution processes Highlights the importance of the understanding of basic principles required for designing and optimizing ECM/EMM/EP processes Gives equal emphasis to the fundamentals and applications of electrodissolution processes Discusses the high-rate anodic dissolution of two broad classes of materials, namely, engineering and refractory materials Presents case studies to demonstrate the capabilities of different electrochemical and assisted machining, micromachining, and finishing operations Presents a dedicated chapter on electrochemical planarization of copper interconnects Madhav Datta is the Chairman of Amrita Center for Industrial Research and Innovation and a Distinguished Professor in the Department of Chemical Engineering and Materials Science, Amrita University, Coimbatore, India.

This volume examines the technological advances made in the development of microsystem technologies using electrochemical techniques. It covers electrochemical microsystem technologies for microelectronics, sensors, materials science, microbiology, neurobiology and applications of microtechnologies and microsystems in medicine and provides an overview of the technological status and development of micropatternings and micro-biosensors and the application of micropower systems.
This book will be a valuable reference source for graduate/postgraduate students, technologists, and researchers working in the field of electrochemical technology.

eBook available with sample pages: 020321921X

This volume illustrates the technological advances made in recent years in the development of battery and other energy storage systems. Discussions of present and near future battery technologies are included as well as emerging energy technologies that have the potential to impact on the portable electronics industry in the long term. This text provides a complete overview of the technology status and trends, with a focus on scientific developments, particularly in materials, that have led to technological breakthroughs.

In this book, the term "electrochemical nanotechnology" is defined as nanoprocessing by means of electrochemical techniques. This introductory book reviews the application of electrochemical nanotechnologies with the aim of understanding their wider applicability in evolving nanoindustries. These advances have impacted microelectronics, sensors, materials science, and corrosion science, generating new fields of research that promote interaction between biology, medicine, and microelectronics. This volume reviews nanotechnology applications in selected high technology areas with particular emphasis on advances in such areas. Chapters are classified under four different headings: Nanotechnology for energy devices - Nanotechnology for magnetic storage devices - Nanotechnology for bio-chip applications - Nanotechnology for MEMS/Packaging.

In this book, the term "electrochemical nanotechnology" is defined as nanoprocessing by means of electrochemical techniques. This introductory book reviews the application of electrochemical nanotechnologies with the aim of understanding their wider applicability in evolving nanoindustries. These advances have impacted microelectronics, sensors, materials science, and corrosion science, generating new fields of research that promote interaction between biology, medicine, and microelectronics.

This volume reviews nanotechnology applications in selected high technology areas with particular emphasis on advances in such areas. Chapters are classified under four different headings: Nanotechnology for energy devices - Nanotechnology for magnetic storage devices - Nanotechnology for bio-chip applications - Nanotechnology for MEMS/Packaging.

In Advanced ULSI interconnects - fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous "Moore's law" which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

In Advanced ULSI interconnects - fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous "Moore's law" which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.